IMB
Use of IMB in Power Semiconductors Electronics as Aluminium oxide DBC replacement:
• Equal or even lower Thermal Resistance than Aluminium oxide DBC
• Baseplate already integrated (no solder joint between circuit and baseplate)
• Wide copper thickness range availability
• Higher Mechanical strength than Aluminium oxide DBC
IMB (Insulated Metal Baseplate) PCBs can be manufactured with more than one layer.
Typical Multilayer IMB stack-up:
• Multilayer section - Electrical connections by means of blind vias
• Insulation layer - Thermal Conductivity up to 10 W/mK, Breakdown Voltage up to 11 kVAC
• Baseplate - aluminum or copper, thickness from 0.5 to 3.0 mm
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